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Chip Coat - メーカー・企業と製品の一覧

Chip Coatの製品一覧

1～8 件を表示 ／ 全 8 件

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Chip coat "Underfill material for CSP/BGA board level"

Chip coat "Underfill material for CSP/BGA board level"

High-purity insulating materials for the purpose of encapsulating semiconductor chips!

The "Underfill Material for CSP/BGA Board Level" is a reinforcement material designed to improve impact resistance and heat cycle durability when secondary mounting packaged bare chips onto a motherboard. It is a capillary flow type material that is injected and sealed, characterized by high reliability and high productivity. 【Features】 ■ Insulating material for injecting and sealing semiconductor chips ■ Capillary flow type ■ Excellent injectability for narrow gaps ■ High reliability, high productivity, and high moisture resistance *For more details, please refer to the PDF document or feel free to contact us.

  • Microcomputer
  • Dedicated IC
  • ASIC

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
Chip coat "Low-temperature curing adhesive"

Chip coat "Low-temperature curing adhesive"

High-purity insulating material for the purpose of sealing semiconductor chips!

The "Low-Temperature Curing Adhesive" is a product of Namix, a trademark of "Chip Coat," which conducts research, development, manufacturing, and sales of electrochemical materials. This product is designed for high-precision bonding and fixing, as well as for bonding components with low heat resistance, and it is an insulating adhesive that can cure at temperatures below 100°C. 【Features】 ■ Insulating material for encapsulating semiconductor chips ■ Low-temperature curing type *For more details, please refer to the PDF document or feel free to contact us.

  • Dedicated IC
  • Other semiconductors
  • glue

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
Chip Coat "Dam & Fill Agent"

Chip Coat "Dam & Fill Agent"

High-purity insulating materials for the purpose of sealing semiconductor chips!

The "Dam & Fill Material" is an insulating material primarily used for sharp dam formation in CSP/BGA and other wire bonding implementations, enabling smooth filling between wires for sealing. It boasts excellent moldability and is a highly reliable material that reduces package warpage. 【Features】 ■ Insulating material for encapsulating semiconductor chips ■ Sharp dam shape ■ Excellent moldability ■ Achieves reduction of package warpage ■ High reliability *For more details, please refer to the PDF document or feel free to contact us.

  • Dedicated IC
  • Other semiconductors
  • others

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
Chip coat "Underfill material for flip chips"

Chip coat "Underfill material for flip chips"

High-purity insulating materials for the purpose of sealing semiconductor chips!

The "Underfill for Flip Chip" is a chip coating that is injected and sealed using a capillary flow type in the implementation technology where the circuit surface of an IC chip with metal bump electrodes is directly electrically connected to the mounting substrate side. It is one of the bare chip mounting methods and can accommodate the flip chip technology that is advancing in various applications, including CPUs and graphic LSIs. 【Features】 ■ One of the bare chip mounting methods ■ Insulating material that seals semiconductor chips ■ Capillary flow type *For more details, please refer to the catalog or feel free to contact us.

  • Microcomputer
  • Dedicated IC
  • ASIC

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
Chip coat "Underfill material for chip on film"

Chip coat "Underfill material for chip on film"

High-purity insulating materials for the purpose of sealing semiconductor chips!

The "Underfill for Chipon Film" is one type of bare chip mounting, where the circuit side of an IC chip with metal bump electrodes is directly electrically connected to the mounting substrate. It is a chip coat that is injected and sealed using a capillary flow type. Among insulating materials, it has good injectability into narrow gaps and excellent moisture resistance, and it is a material compatible with flexible substrates, mainly used in mounting substrates for LCD drivers and similar applications. 【Features】 ■ One type of bare chip mounting ■ Insulating material for sealing semiconductor chips ■ Capillary flow type ■ Excellent injectability into narrow gaps ■ Excellent moisture resistance *For more details, please refer to the PDF document or feel free to contact us.

  • Microcomputer
  • Dedicated IC
  • ASIC

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
Chip coat "Pre-supply type underfill material (NCP)"

Chip coat "Pre-supply type underfill material (NCP)"

High-purity insulating materials for the purpose of sealing semiconductor chips!

The 'Pre-supply Type Underfill Material (NCP)' is a pre-supply type paste underfill material. After applying it to the substrate or interposer, the chip is thermocompression bonded (TCB) and sealed. It is a material that can improve productivity and support fillet width control (KOZ compatible). 【Features】 ■ Insulating material for encapsulating semiconductor chips ■ Pre-supply type paste ■ Improved productivity ■ Compatible with fillet width control *For more details, please refer to the PDF document or feel free to contact us.

  • Microcomputer
  • Dedicated IC
  • ASIC

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
Chipcoat "Adhesive for Camera Modules"

Chipcoat "Adhesive for Camera Modules"

High-purity insulating materials for the purpose of sealing semiconductor chips!

The "adhesive for camera modules" is an insulating adhesive that allows for a process with minimal shrinkage due to UV curing. It is intended for bonding and fixing applications that require high positional accuracy, as well as for bonding materials with low heat resistance. 【Features】 ■ Insulating material for encapsulating semiconductor chips ■ Curing by UV irradiation ■ Low-temperature curing ■ High reliability *For more details, please refer to the PDF document or feel free to contact us.

  • Dedicated IC
  • Other semiconductors
  • glue

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
Chip coat "Diatatch agent"

Chip coat "Diatatch agent"

High-purity insulating materials for the purpose of sealing semiconductor chips!

"Die Attach Adhesive" is one of the methods for mounting bare chips, where the circuit side of an IC chip with metal bump electrodes is adhered to the opposite side of the mounting substrate using a dispensing type insulating material for the mounting technology. 【Features】 ■ Insulating material for encapsulating semiconductor chips ■ One of the methods for bare chip mounting ■ Dispensing type *For more details, please refer to the PDF document or feel free to contact us.

  • Dedicated IC
  • Other semiconductors
  • others

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
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